JobsPackaging Module Development Engineer
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Packaging Module Development Engineer

Intel

Location

Hillsboro, OR

Type

Full-time

Posted

10/1/2026

Compensation

$115,110 - $219,550 per year

Undergraduate with 5+ Years of Experience
Master's with 2+ Years of Experience
H-1B FY202694.2% approval-88% YoY
💎 Strong sponsor

Job description

The role involves joining the Materials Technology Development team at Intel, focusing on driving materials technology development for advanced packaging. The ideal candidate will have a strong background in Materials Science and will collaborate with cross-functional teams to deliver innovative materials solutions. This position requires problem-solving skills to address materials-process-equipment challenges and ensure quality and reliability in packaging technologies. Regular onsite presence is required to fulfill essential job responsibilities.

Requirements

  • Bachelor's degree with 4+ years of experience, Master's degree with 3+ years of experience, or Ph.D. in a relevant field such as Materials Science, Metallurgy, Chemical Engineering, Chemistry, Mechanical Engineering, or a related discipline.
  • 4+ years of hands-on experience in packaging module development, process characterization, or equipment optimization.
  • Experience in collaborating with cross-functional teams, suppliers, and manufacturing operations to achieve shared goals.
  • Proficiency in Design of Experiments (DOE) principles and statistical data analysis tools.

Responsibilities

  • Develop assembly materials, processes and/or equipment and apply novel concepts for innovative solutions.
  • Optimize and improve the efficiency of manufacturing packages to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
  • Develop process and equipment specifications and document improvements through white papers.
  • Establish material specifications for contract assemblers and raw material vendors.
  • Develop new techniques and acceleration methods to ensure early identification of potential problems with packaging materials quality.
  • Set reliability requirements to meet customer needs and influence design, material selection, and process development.
  • Lead efforts towards innovating, problem solving, and continuously improving materials, equipment, and processes.
  • Provide consultation concerning packaging problems and improvements in the packaging process.

Benefits

  • Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.

H-1B filing history

Public USCIS petition and DOL LCA counts · latest USCIS FY2026, LCA FY2026

Filing entity: Intel Corp

As of Aug 23, 2026

Initial approvals

74

FY2026

Approval rate

94.2%

FY2026

LCA certified

2,201

FY2026

Entry-level share

0.1%

FY2026

Initial approvals YoY

-88%

Trend

LCA certified YoY

-54%

Trend

Initial approvals by fiscal year

Approval rate by fiscal year

Continuing vs initial approvals

LCA certified positions by quarter

LCA certified positions by fiscal year

Based on public USCIS and DOL filings; not a sponsorship guarantee.

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