JobsPackaging Module Development Engineer
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Packaging Module Development Engineer

Intel

Location

Phoenix, AZ

Type

Full-time

Posted

10/1/2026

Compensation

$133,800 - $255,200 per year

Undergraduate with 2+ Years of Experience
H-1B FY202694.2% approval-88% YoY
💎 Strong sponsor

Job description

Intel Corporation is seeking a Packaging Module Development Engineer specializing in Laser and Optical Processing to join their Substrate Packaging Technology Development organization in Chandler, Arizona. This role focuses on developing and integrating next-generation laser and optical process technologies for advanced semiconductor packaging solutions. The engineer will work with a team of world-class engineers and researchers to influence the performance and reliability of future semiconductor products. The position emphasizes collaboration, innovation, and a commitment to improving manufacturing processes.

Requirements

  • Ph.D. in Optical Engineering, Optics, Photonics, Physics, Applied Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related STEM field, or a Master's degree with 1+ years of relevant experience, or a Bachelor's degree with 3+ years of relevant industry experience.
  • Hands-on experience with laser, optical, photonic, or related advanced processing technologies.
  • Proficiency in programming or scripting tools such as Python, MATLAB, JMP/JSL, C++, or LabVIEW.
  • Experience applying experimental methods, statistical analysis, and data-driven problem-solving to technical challenges.
  • Strong analytical, troubleshooting, and communication skills.

Responsibilities

  • Develop and optimize laser, optical, and advanced packaging processes for next-generation semiconductor technologies.
  • Design and execute experiments, analyze data, and drive process improvements using scientific and statistical methods.
  • Support the installation, qualification, and ramp of new equipment and process technologies.
  • Investigate process and equipment issues, perform root-cause analysis, and implement solutions to improve yield and reliability.
  • Collaborate across engineering teams and document technical findings to support technology development and manufacturing readiness.

Benefits

  • Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.

H-1B filing history

Public USCIS petition and DOL LCA counts · latest USCIS FY2026, LCA FY2026

Filing entity: Intel Corp

As of Aug 23, 2026

Initial approvals

74

FY2026

Approval rate

94.2%

FY2026

LCA certified

2,201

FY2026

Entry-level share

0.1%

FY2026

Initial approvals YoY

-88%

Trend

LCA certified YoY

-54%

Trend

Initial approvals by fiscal year

Approval rate by fiscal year

Continuing vs initial approvals

LCA certified positions by quarter

LCA certified positions by fiscal year

Based on public USCIS and DOL filings; not a sponsorship guarantee.

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