As a Semiconductor Research Engineer at Intel, you will lead innovative research and development in semiconductor technologies, focusing on the design and fabrication of novel devices and interconnects. You will work within the Thermal Core Comp organization, contributing to advancements in assembly packaging solutions. This role emphasizes collaboration across teams to optimize performance and reliability while driving industry progress. Your hands-on experiments and methodologies will play a crucial role in shaping the future of semiconductor technology.

• Bachelor's or BS degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field.
• 6+ years of experience with a bachelor's degree, 4+ years with a master's degree, or 2+ years with a PhD.
• Advanced experience in semiconductor fabrication processes, such as lithography, etch, diffusion, and packaging design methodologies.
• Advanced experience in simulation tools (e.g., Ansys, Abaqus) for finite element analysis and computational fluid dynamics.
• Advanced programming skills in Python or MATLAB for engineering applications.
• Hands-on experience with experimental setups and data analysis techniques for lab testing.
• Experience with advanced packaging technologies, including EMIB and Foveros architectures.
• Expertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques.
• Familiarity with materials characterization techniques and cross-disciplinary collaboration with academia and external partners.
• Proven ability to lead and influence technical teams to achieve milestones and drive performance improvements.
• Strong analytical and problem-solving abilities to address unique engineering challenges effectively.
• Excellent organizational and communication skills, with experience presenting findings and mentoring team members.

• Conduct research leveraging device physics, thermomechanical analysis, materials science, and process innovations to enable novel devices and systems.
• Design and fabricate prototypes to demonstrate proof-of-concepts for groundbreaking packaging and interconnect technologies.
• Perform electrical testing and establish methodologies for device characterization, including DC, RF signal analysis, pulsing, and stressing.
• Develop process solutions across production modules, such as lithography, etch, diffusion, CVD, PVD, and CMP, to address technological challenges.
• Plan and execute experiments in collaboration with device, reliability, and fabrication teams to benchmark results against industry standards.
• Develop models and measurements to advance the understanding of device physics, packaging, and systems for future technology platforms.
• Engage with external vendors and researchers to support collaborations and Intel's research pipeline.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.