The Packaging Module Development Engineer is responsible for developing assembly processes and equipment to support Intel's future packaging technologies. This role focuses on optimizing manufacturing efficiency while ensuring quality, reliability, and cost-effectiveness. The engineer will also develop specifications and document improvements, while collaborating with various teams to meet material quality and vendor performance requirements. Regular onsite presence is required to fulfill essential job responsibilities.

• PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 1+ years of experience.
• 1+ years of experience applying statistical analysis techniques including Design of Experiments (DOE) and Statistical Process Control (SPC).
• 1+ years of experience with process development, characterization, optimization, or qualification in semiconductor manufacturing or related advanced technology environments.
• Minimum cumulative GPA of 3.5.

• Develop assembly processes and equipment for innovative packaging solutions.
• Optimize manufacturing efficiency to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Establish material specifications and interface with supplier quality and procurement teams.
• Develop new techniques and tools for early identification of packaging quality issues.
• Lead efforts in innovating and improving equipment and processes using experimental design and statistical methods.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.