The Stress Test and Reliability Laboratory is seeking a hands-on engineer to join their environmental stress tool engineering team in Chandler, AZ. This role focuses on supporting dynamic stress capabilities, specifically in developing and executing mechanical reliability and environmental stress testing programs for semiconductor devices. The engineer will work with a fleet of equipment to evaluate Intel's technologies under various simulated field conditions. The position requires expertise in shock, vibration, and dynamic mechanical loading methodologies.

• Bachelor's degree in Mechanical Engineering, Aerospace Engineering, Materials Engineering, or a similar STEM-related degree with 4+ years of experience in shock and vibration stress testing/methods.
• Master's degree with 1+ years of experience in shock and vibration stress testing/methods.
• PhD with 6 months+ of experience in shock and vibration stress testing/methods.
• Hands-on experience conducting shock and vibration testing using electrodynamic shakers and mechanical shock equipment.
• Working knowledge of JEDEC and/or IPC standards related to board-level reliability and mechanical stress testing.

• Develop, plan, and execute dynamic stress tests, including shock, vibration, and other test methods in compliance with JEDEC, IPC, and/or customer requirements.
• Develop test fixtures, instrumentation strategies, and data acquisition systems to support mechanical reliability evaluations.
• Perform testing on devices in collaboration with the operations team.
• Analyze test data using statistical and engineering methods to identify failure modes, performance limits, and reliability risks.
• Generate detailed test plans, procedures, reports, and qualification documentation.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.