The Advanced Packaging Development Engineer for Quantum AI at Google will focus on developing innovative packaging technologies for quantum processors and related components. This role involves collaborating with the quantum processor team and RF engineers to transition research concepts into deployable packaging solutions. The engineer will work in a team dedicated to building custom packaging technologies that operate in cryogenic environments. The position is critical for advancing the capabilities of quantum computing and enabling meaningful applications.

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field.
• 5 years of experience in packaging development, including simulation, layout and design, process engineering, assembly, test and measurement, and failure analysis.
• 5 years of experience with technologies such as 2.5D/3D integration, wafer level packaging, and bump bonding.
• 3 years of experience delivering R&D concepts to a released product.
• 3 years of experience developing advanced packaging solutions.

• Design, architect, and implement novel packaging platforms.
• Investigate and characterize electrical, thermal, and mechanical properties of packaging materials.
• Develop and document new process flows and Design-For-Integration principles for emerging technologies.
• Lead technical engagements with external vendors and partners to evaluate and qualify next-generation packaging processes.
• Conduct root cause analysis and develop mitigation strategies for performance-limiting factors unique to new technologies.

• Employees at Google are often offered benefits like comprehensive health insurance, 401(k) matching, and flexible work arrangements, among other benefits.