AMD is seeking a Senior Director of Packaging Engineering to lead the strategy, development, and execution of advanced IC packaging technologies. This role involves building a strong engineering team and guiding package development from concept through manufacturing ramps. The successful candidate will work closely with product teams and suppliers to deliver solutions that meet performance, reliability, cost, and schedule requirements. This position requires a highly respected engineering leader capable of influencing executives and managing large global teams.

• Significant experience in semiconductor IC packaging engineering with a track record of advancing to director-level technical leadership.
• Direct experience developing and qualifying packaging solutions for complex digital, mixed-signal, RF, or high-speed silicon.
• Deep technical expertise across advanced and standard packaging technologies such as WLCSP, flip-chip, and chiplet interconnect.
• Demonstrated expertise in package-level signal integrity engineering and power integrity engineering.
• Experience managing OSAT, substrate, and/or PWB supplier partnerships.
• Excellent cross-functional leadership and communication skills.

• Champion best practices in design-for-manufacturability, reliability, and cost optimization across the packaging technology portfolio.
• Lead, mentor, and grow a global team of engineers and technical leads.
• Own end-to-end packaging development from concept through new product introduction and high-volume manufacturing.
• Direct package-level signal integrity and power integrity co-design strategy.
• Own thermal and mechanical package design strategy.
• Participate in strategic relationships with OSAT, substrate, and PWB supply partners.
• Partner cross-functionally with business units to translate product requirements into scalable packaging solutions.
• Drive technology proliferation and standardization initiatives.
• Represent AMD's packaging technology strategy in cross-functional and executive reviews.
• Drive innovation in heterogeneous integration and high-speed packaging.
• Establish and monitor engineering budgets, headcount planning, and program schedules.

• AMD provides a competitive 'Total Rewards' package that focuses on financial growth, health, and work-life balance.