This position is a senior leadership role at Qualcomm, focusing on RF Package Design for 6G infrastructure and consumer devices. The candidate will lead the Electrical Characterization of RF Packages and work closely with RF design leads. Responsibilities include defining the packaging roadmap, overseeing design advancements, and managing a team of engineers. The role requires a deep understanding of RF package design and the ability to navigate ambiguous project definitions.

• Master's degree in Science, Engineering, or a related field.
• 10+ years of RF Package/PCB design experience.
• Solid understanding and experience in Electromagnetics, Transmission line theory, and Crosstalk.
• Proficiency in field solvers such as Ansys HFSS, Q3D, and PSI.
• Proficiency in simulation tools such as ADS and Hspice.
• Good knowledge in design tools such as Cadence Allegro/APD/Sip or Mentor Xpedition.

• Work with package designers and various RF-IC block owners to discuss bump/ball assignments and perform early analysis.
• Establish best-known methods for extracting 3D parasitic models for various RF packages in ANSYS Electronic Desk Suite.
• Guide the team in troubleshooting various RF problems efficiently in testbench.
• Further define methodologies for RF simulations for various package types, frequency bands, and IP requirements.
• Collaborate with the Advanced Technology team to develop more robust future RF packaging technology.
• Update the design and analysis flow and automate the process.
• Create technical documentation and presentations.
• Recruit and lead a team of engineers while providing technical mentoring to junior team members.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.