Qualcomm is seeking a Principal Thermal Engineer to address complex thermal challenges and enhance performance across the Qualcomm Dragonfly™ AI300 platform and future AI computing platforms. This role involves working on advanced thermal architecture, simulation, validation, and optimization while collaborating with experts in silicon, packaging, hardware, and system engineering. The position offers the opportunity to contribute to innovative AI products from concept to production. The ideal candidate will lead thermal architecture solutions and drive strategy discussions with various stakeholders.

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of relevant experience, or a Master's degree with 3+ years of experience, or a PhD with 2+ years of experience.
• 6+ years of industry experience in electronics cooling, focusing on high-performance computing, AI, or data center products.
• Experience developing thermal solutions for high-power processors, GPUs, or AI accelerators using various cooling technologies.
• Strong expertise in computational fluid dynamics (CFD) analysis and experience with industry-standard tools.
• Proficiency in scripting and programming for data analysis and model automation using languages such as Python, C/C++, or MATLAB.

• Lead thermal architecture solutions through simulation and testing while collaborating with stakeholders.
• Perform thermal simulations utilizing CFD tools throughout the product development phase.
• Drive direction and strategy discussions and conduct thermal design reviews.
• Conduct thermal tests to validate and characterize models and present results to stakeholders.
• Analyze and document simulation and test results.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.