Job description
The Advanced DRAM Lithography Engineer will focus on developing and optimizing lithography processes for advanced DRAM technologies. This role is situated within the Infrastructure & Technology team at IBM, emphasizing innovation and precision in semiconductor manufacturing. The engineer will work onsite in Albany, New York, contributing to projects that require a blend of technical expertise and collaboration. The position involves significant travel based on project requirements, allowing for dynamic engagement with various teams.
Requirements
- A degree in Electrical Engineering, Materials Science, or a related field is preferred.
- Experience in semiconductor lithography processes is essential.
- Strong analytical skills and problem-solving abilities are required.
- Familiarity with advanced imaging techniques and equipment is beneficial.
Responsibilities
- Develop and refine lithography processes for next-generation DRAM products.
- Collaborate with cross-functional teams to integrate new technologies.
- Conduct experiments and analyze data to improve process efficiency.
- Travel up to 40% of the time to support project needs and team collaboration.
Benefits
- IBM offers competitive compensation, healthcare coverage, retirement programs, paid parental leave, tuition assistance, wellness programs, flexible work options, and extensive learning and certification resources.
H-1B filing history
Public USCIS petition and DOL LCA counts · latest USCIS FY2026, LCA FY2026
Filing entity: Ibm Corporation
As of Aug 23, 2026
Initial approvals
656
FY2026
Approval rate
97.2%
FY2026
LCA certified
391
FY2026
Entry-level share
0.0%
FY2026
Initial approvals YoY
+31%
Trend
LCA certified YoY
-85%
Trend
Initial approvals by fiscal year
Approval rate by fiscal year
Continuing vs initial approvals
LCA certified positions by quarter
LCA certified positions by fiscal year
Based on public USCIS and DOL filings; not a sponsorship guarantee.
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