The Quantum Interposer Integration Engineer at IBM Research focuses on integrating and optimizing processes for manufacturing superconducting interposers and advanced wafer-level components. This role involves collaboration with various teams, including fabrication, metrology, and packaging, to ensure high-quality manufacturing performance. The engineer will engage in hands-on work with deposition, etch, lithography, and bonding technologies. This position is essential for advancing IBM's silicon spin quantum computing initiatives.

• Bachelor's degree in Electrical Engineering, Physics, Chemistry, Materials Science, or a related field.
• 7+ years of relevant experience in semiconductor or advanced packaging manufacturing processes.
• Hands-on experience with silicon spin interposer technologies.
• Familiarity with bonding technologies such as indium bumping, gold thermocompression, and solder-based interconnects.

• Collaborate with wafer-level manufacturing teams to refine and technically guide superconducting interposer wafer flows.
• Develop and optimize post-process flows for superconducting interposers, including deposition, etching, and lithography.
• Select equipment and processes, guiding the installation and qualification of required processes.
• Support and optimize various wafer bonding technologies to meet performance targets.
• Conduct hands-on characterization and structured experimentation to validate process interactions.

• IBM offers competitive compensation, healthcare coverage, retirement programs, paid parental leave, tuition assistance, wellness programs, flexible work options, and extensive learning and certification resources.