The Qualcomm Package Electrical Team is seeking a candidate to focus on signal integrity and power integrity within package design. This leadership role involves collaborating with package and IC designers to optimize designs and ensure system-level constraints are met before package Tape-out. The candidate will also communicate with PHY owners and PCB designers to assess performance impacts and provide technical guidance to management. This position offers the opportunity to lead a team of engineers across multiple international locations.

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of relevant experience, or a Master's degree with 5+ years of experience, or a PhD with 4+ years of experience.
• Experience in AUTO package design and analysis.
• Ability to use AI to enhance team efficiency.
• Experience in SerDes design specifications such as PCIe Gen-x, USB, UFS in Server design.
• Experience in Matlab for automating simulation flow.
• Proficiency in programming languages such as C/C++ or scripting languages like Perl/Python is a plus.

• Perform package extraction for time domain and frequency domain analysis.
• Conduct system-level analysis for DDR, SerDes, and mixed signal interfaces.
• Provide design guidelines for package design.
• Perform system simulation and offer feedback for design optimization.
• Develop design and analysis flow and automate the process.
• Create technical documentation and presentations.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.