Qualcomm is seeking an IC Package Design Engineer to join its Data Center team, which focuses on developing high-performance and energy-efficient server solutions. The role involves advanced package selection, physical design, and optimization for various chip types. Candidates will work collaboratively with multi-functional teams to enhance mechanical, electrical, and thermal performance. This position offers an opportunity to drive innovations and efficiency improvements in package design.

• Master's degree in electrical engineering, mechanical engineering, material science, or related fields with 5+ years of experience.
• Proficient in Cadence APD & SiP and/or Siemens Xpedition Package Designer.
• Familiarity with Constraint Manager in package design tools for setting up DFM and electrical rules.
• Basic knowledge in signal integrity for high-speed IO interfaces and electronic packaging processes.
• Experience with Calibre tool and package design reviews.

• Own and drive advanced package selection and configuration optimization.
• Responsible for package/SIP physical design, layout, optimization, DV, and tape out.
• Work with multi-functional teams to achieve optimized mechanical, electrical, and thermal performance.
• Implement the physical design of packages and modules for SoC.
• Define and develop design verification and automation strategies to streamline package design.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.