Qualcomm is seeking a Principal Engineer to lead a 2.5D/3D Advanced Package Design team focused on high-performance compute and Datacenter products. This role involves developing and improving scalable package design methodologies while managing a team of engineers. The ideal candidate will have extensive experience in advanced packaging technologies and a proven track record in team leadership. The position requires strategic vision and the ability to translate emerging technologies into effective product execution.

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.
• Proven experience building and leading advanced package design teams.
• Deep knowledge of 2.5D/3D integration technologies and structures.

• Build, manage, mentor, and grow a high-performing 2.5D/3D advanced package design team.
• Own the strategy, roadmap, architecture, implementation, qualification, and deployment of 2.5D/3D package design methodologies.
• Develop standardized, scalable, and reusable flows for complex multi-die products.
• Lead implementation of 2.5D/3D packages using various advanced integration technologies.
• Evaluate and deploy foundry and EDA-vendor 3DIC solutions.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.