The 3DIC Device Development Engineer will work within the Manufacturing Development and Customer Engineering team at Intel Foundry, focusing on advanced 3D integration technologies. This role involves characterizing and modeling the impact of these technologies on device performance, particularly for AI accelerators and high-performance computing solutions. The engineer will transform complex silicon data into actionable insights and collaborate with various teams to resolve device-related issues. The position requires a deep understanding of CMOS device physics and a passion for innovative semiconductor solutions.

• Master's degree in Electrical Engineering, Physics, Materials Science, or a related field with 4+ years of industry experience in semiconductor device engineering.
• 3+ years of experience in advanced CMOS device characterization and electrical parametric data analysis.
• Hands-on experience with advanced packaging and 3D integration technologies such as through-silicon vias, hybrid bonding, and wafer thinning.

• Characterize and model the impact of advanced 3D integration technologies on device performance metrics.
• Evaluate stress, thermal, and electrical coupling effects within complex 3D stacks.
• Define and develop device and passive test structures to study 3DIC effects.
• Drive electrical test strategy, data collection, and silicon analysis for technology optimization.
• Provide device characterization inputs for design rule development and compact models.
• Collaborate with various teams to identify and resolve device-related issues.
• Evaluate customer requirements for devices within 3D architectures.
• Support technology qualification and manufacturing readiness activities.
• Communicate complex technical findings to engineering and customer stakeholders.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.